Last edited by Vulmaran
Saturday, May 2, 2020 | History

7 edition of Solder Joint Technology found in the catalog.

Solder Joint Technology

Materials, Properties, and Reliability (Springer Series in Materials Science) (Springer Series in Materials Science)

by King-Ning Tu

  • 315 Want to read
  • 30 Currently reading

Published by Springer .
Written in English


The Physical Object
Number of Pages386
ID Numbers
Open LibraryOL7445750M
ISBN 100387388907
ISBN 109780387388908

8 Long lasting copper tube is a favorite choice for plumbing, heating, cooling and other systems. In the United States, it is manufactured to meet the requirements of specifications. Ansys Solder Joint Reliability Simulation Solutions In today’s competitive business environment balancing the conflicting demands of miniaturization, performance and efficiency are paramount. In demanding Ball Grid Array (BGA) applications, the solder joints are a primary point of failure.

Furthermore, the growth of Cu6Sn5 and Cu3Sn layers for Sn37Pb/Cu solder joint and the total IMC layer at the interface of Sn37Pb–xZn (x = 0, 5, and 10 wt%) solder with Cu substrate followed the.   Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies.

solder joint reliability performance when compared to a single row design of similar body size. Since there are no lead fingers in the immediate corners of the package for the dual row design, which is typically the highest stress area of the package during testing, the overall solder joint lifetime can be increased. Although the typical failed File Size: 1MB. For instance, the book by Tu Solder Joint Technology: Materials, Properties, and Reliability has a chapter on ductile to brittle transition in solder, toward the end of the book. This is after the more commonly known stuff on the alloys solder forms etc.


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Solder Joint Technology by King-Ning Tu Download PDF EPUB FB2

To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood.

In this book, the advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are.

To improve solder joint reliability, the science of solder joint behavior under various driving forces must be understood. In this book, Solder Joint Technology book advanced materials reliability issues related to copper-tin reaction and electromigration in solder joints are emphasized and methods to prevent these reliability problems are Brand: Springer-Verlag New York.

Solder Joint Technology: Materials, Properties, and Reliability (Springer Series in Materials Science) th Edition by King-Ning Tu (Author) out of 5 stars 1 rating. ISBN ISBN Why is ISBN important. ISBN.

This bar-code number lets you verify that you're getting exactly the right version or edition of a Cited by: Im glad I purchased this book because I didn't realise how important it is to have a De-Soldering Solder Joint Technology book as a tool.

Before purchasing this book I only had a De-Soldering Pump for solder removal. A De-Soldering is great for removing a lot of solder from a connection.

However, when removing a Surface Mount Device (SMD) a De-Soldering Wick rules/5(60). Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn’t work with solder without Solders and Soldering, Fourth Edition.

Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You’ll learn 29 different methods for soldering and heating (for both automatic and manual 5/5(1).

Solder Joint Technology. /_ In book: Handbook of Manufacturing Engineering and Technology (pp) Solder joint reliability of lead free solders (Sn-Ag-Cu.

Publisher Summary. The processing of solder paste starts with paste handling and storage; therefore, there are certain associated problems. This chapter discusses the major problems related to solder paste applications in surface mount technology (SMT) prior to reflow, with a primary emphasis on storage, deposition, and component placement.

Soldering (AmE: / ˈ s ɒ d ər ɪ ŋ /, BrE: / ˈ s oʊ l d ər ɪ ŋ /) is a process in which two or more items are joined together by melting and putting a filler metal into the joint, the filler metal having a lower melting point than the adjoining metal.

Unlike welding, soldering does not involve melting the work brazing, the work piece metal also does not melt, but the filler.

Solder joints are ubiquitous in electronic consumer products. The European Union has a directive to ban the use of Pb-based solders in these products on July 1st, There is an urgent need for an increase in the research and development of Pb-free solders in electronic manufacturing.

For example, spontaneous Sn whisker growth and electromigration induced failure in solder joints are Cited by: The Fundamentals of Solder Joint of Solder Joint Design – Part 1 – Through Hole Technology (THT) 1. SOLDER JOINT CRITERIA Designed for: • Electrical conductivity • Mechanical stability • Heat dissipation 2.

SOLDER JOINT CRITERIA Solder Joint Must Have. solder joint that holds it to the surface of the laminate. As pa rts get smaller, so does the amou nt of solder and thus the stre ngth of the bond.

Through-hole components are best used for high reliability products that require stronger connections between layers. While. Solder joint reliability is defined as the ability of your product’s solder joints to function under given conditions and for a specified period of time without exceeding acceptable failure levels.

Whether you are trying to implement a new solder type or new component. Solder joints are ubiquitous in electronic consumer products. With the European Union s directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free : King-Ning Tu.

Professional reflowsoldering equipment and printable solder pastes became commercially available by the early s, when SMDs had begun to be used on conventional circuit boards.

The making of a good soldered joint needs the right amount of solder, flux, and heat, in the right place, and at the right time. A solder joint consists of a number of quite different materials, many of which are only superficially characterized.

A solder joint consists of (1) the base metal at the PWB, (2) one or more intermetallic compounds (IMC)—solid solutions—of a solder constituent—typically. Solder (/ ˈ s oʊ l d ər /, / ˈ s ɒ l d ər / or in North America / ˈ s ɒ d ər /) is a fusible metal alloy used to create a permanent bond between metal workpieces.

Solder is melted in order to adhere to and connect the pieces together after cooling, which requires that an alloy suitable for use as solder have a lower melting point than the pieces being joined.

The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology.

Solder is the electrical and me­ chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica­ tions as well as a more concerted effort to better understand. SURFACE MOUNT TECHNOLOGY (SMT) GENERAL REQUIREMENTS (cont.) UNACCEPTABLE.

GOLD INTERMETALLIC. Gold intermetallic can severely embrittle a solder joint. NASA-STD [b] UNACCEPTABLE. GOLD PLATING. Gold plating surfaces that will become a part of the finished solder connection shall be tinned prior to soldering to remove the gold. Wei S, Zhu WH, Poh ESW, Tan HB, Gan RT () Study of five substrate pad finishes for the co-design of solder joint reliability under board-level drop and temperature cycling test conditions.

In: International conference on electronic packaging technology & high sensity packaging, Shanghai, China p. The smt joint is vastly weaker • Smaller in size • Less solder in the joint The SMT joint exhibits a shift from a large PTH to a smaller lap or butt joint, creating a change in the stress distribution as well as the ratio between component weight and solder support 8File Size: 2MB.

Get this from a library! Solder joint technology: materials, properties, and reliability. [K N Tu].Lap Joint. A lap joint is formed when two pieces overlap each other and solder is applied between the two pieces.

The strength of this joint depends on how much of an overlap is created. The larger the overlapped area, the stronger the soldered joint.

Side Seam Joint. Similar to the lap joint, the side seam joint is stronger than a simple lap.Solder joints are ubiquitous in electronic consumer products. With the European Union’s directive to ban the use of lead-based (Pb) solders in these products, there is an urgent need for research on solder joint behavior under various driving forces in electronic manufacturing, and for development of lead-free solders.

For example, spontaneous Sn whisker growth and electromigration induced.